- Attachment Method：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Shape：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Filter：
173 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 60 ... |
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEATSINK HALF BR... |
0.000
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEATSINK HALF BR... |
0.000
|
35,000
In-stock
|
Add To Rfq Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
0.000
|
35,000
In-stock
|
Add To Rfq Get Quote |
